In the highly precise and complex environment of semiconductor manufacturing, the accuracy of information traceability and the automation of production processes directly affect yield and efficiency. Traditional manual operations (such as triggering ID reads after loading materials) not only slow down operations but also carry the risk of data errors. RFID technology offers a solution that enhances process precision, improves traceability, and automates critical steps in semiconductor production.
Data delay and errors due to manual intervention.
Incomplete traceability of wafer processing information, affecting process optimization and anomaly analysis.
Lack of standard communication protocols between devices, leading to information silos and inefficiencies.
Superisys integrates SECS/SEMI standard protocols with high-performance RFID technology to create a fully automated data link for wafer production. This solution enables real-time traceability, data transparency, and smart decision-making throughout the production process.
Connect RFID, IO modules, sensors, and LED lights.
Place the wafer box containing capsules onto the LoadPort.
Once the machine’s pressure sensor detects the presence of the wafer, the IO module triggers the input.
The RFID controller detects the input from the IO module, reads the capsule ID, and reports the data to the EAP system.
In this application, RFID chips such as RF-LT-DR2B are installed on LoadPort devices, with RFID controllers (RF-LC12097) and RFID readers (RF-LA5010) placed at each process step. As wafers move through different stages, RFID readers accurately identify the information associated with each wafer and upload it to the ERP system, ensuring seamless integration with production equipment, transparent data transmission, and proper anomaly handling.
RF-LC12097 (Industrial RFID Controller)
RF-LA5010 (Industrial RFID Reader)
RF-LT-DR2B (Industrial RFID Tag)
Eliminate manual ID reading: Instead of triggering ID readings manually, the RFID system automatically reports the ID when the wafer box reaches the correct position.
Complete process traceability: The system captures process data and integrates it with the ERP system for transparent tracking of every wafer’s journey.
Improve yield: Minimize human error and ensure 100% traceability of process data.
Reduce costs and improve efficiency: Full automation of data collection lowers labor costs and speeds up production cycles.
Enable smart decision-making: Real-time dashboards assist with process optimization and predictive maintenance.
Precise Identification & Active Reporting
The RF-LT-DR2B RFID tag integrated in the LoadPort automatically reports the ID when the wafer box is in place. This replaces manual triggering and ensures real-time data accuracy with millisecond-level response.
Full-Process Traceability & Data Closure
Real-time collection of wafer processing data and seamless integration with MES/ERP systems creates a comprehensive production information database. The system supports both forward traceability (current process state) and reverse traceability (historical process paths), helping to quickly locate the root cause of anomalies.
SECS/SEMI Standard Integration
By using SECS/GEM protocols, the system enables efficient communication between equipment, breaking down information silos and improving system compatibility and scalability. This ensures compliance with SEMI international standards, making the solution universally applicable and reliable within the semiconductor industry.
| Protocol/Standard | Description | Corresponding SEMI Standard |
|---|---|---|
| SEM | Dedicated Card | SEMI E82 / E88 / ... |
| GEM | Action on Receiving Messages | SEMI E30 |
| SECS-II | Writing Protocol | SEMI E5 |
| SECS-I | HSMS | SEMI E4 / E37 (E-Mail) |
| Product Model | RF-LC12097 | RF-LC103145-2ANT | RF-LC103145-4ANT | RF-LC164210-16ANT |
|---|---|---|---|---|
| Operating Frequency | 134.2kHz | 134.2kHz | 134.2kHz | 134.2kHz |
| Operating Mode | HDX | HDX | HDX | HDX |
| Wireless Protocol | ISO 11784, ISO 11785 | ISO 11784, ISO 11785 | ISO 11784, ISO 11785 | ISO 11784, ISO 11785 |
| Power Voltage | 9~30VDC | 9~30VDC | 9~30VDC | 9~30VDC |
| Average Current | <0.2A@24VDC | <0.2A@24VDC | <0.2A@24VDC | <0.2A@24VDC |
| LED Indicators | 4 LEDs | 4 running LEDs + 2 antenna LEDs | 4 running LEDs + 4 antenna LEDs | 4 running LEDs + 16 antenna LEDs |
| Antenna Ports | 1 | 2 | 4 | 16 |
| Antenna Interface Type | BNC Female | BNC Female | BNC Female | 2P 5.0mm pitch terminal block |
| Communication Interface | Ethernet, RS-485, RS-232 | Ethernet, RS-485, RS-232 | Ethernet, RS-485, RS-232 | Ethernet, RS-485, RS-232 |
| Communication Protocol | SECS | SECS | SECS | SECS |
| Shape Dimensions | MODBUS TCP | MODBUS TCP | MODBUS TCP | MODBUS TCP |
| Mounting Type | MODBUS RTU | MODBUS RTU | MODBUS RTU | MODBUS RTU |
| Housing Material | Aluminum Alloy | Aluminum Alloy | Aluminum Alloy | Aluminum Alloy |
| Housing Color | Gray | Black | Black | Black |
| Operating Temperature | -25°C ~ 70°C | -25°C ~ 70°C | -25°C ~ 70°C | -25°C ~ 70°C |
| Storage Temperature | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C |
| Humidity | 5%~95%RH (non-condensing) | 5%~95%RH (non-condensing) | 5%~95%RH (non-condensing) | 5%~95%RH (non-condensing) |
| Electrostatic Discharge Immunity (SED) | IP20, EN 60529 | IP20, EN 60529 | IP20, EN 60529 | IP20, EN 60529 |
| RoHS Compliance | 2mm (f=5...29.5Hz) | 2mm (f=5...29.5Hz) | 2mm (f=5...29.5Hz) | 2mm (f=5...29.5Hz) |
| Product Model | RF-LA5010 |
|---|---|
| Operating Frequency | 134.2kHz |
| Antenna Interface Type | BNC Male |
| Cable Type | Coaxial Cable |
| Cable Length | 2 meters |
| Dimensions | 50 * 28 * 10 mm |
| Mounting Type | 4 M3 screw holes |
| Housing Material | PC + ABS |
| Housing Color | Black |
| Operating Temperature | -25°C ~ 70°C |
| Storage Temperature | -25°C ~ 85°C |
| Humidity | 5%~95% RH (non-condensing) |
| Waterproof & Dustproof Rating | IP67, EN 60529 |
| Vibration Resistance | 2mm (f=5...29.5Hz), EN 60068-2-6 |
| RoHS Compliance | 7gn (f=29.5...150Hz), EN 60068-2-6 |
| Product Model | RF-LA5010 |
|---|---|
| Dimensions | 3.85 * 32.2 mm |
| Housing Material | Glass |
| Protection Rating | IP68 |
| Operating Temperature | 0°C ~ 70°C |
| Storage Temperature | -40°C ~ 125°C |
| Operating Frequency | 134.2 kHz |
| Air Interface Protocol | ISO 11784, ISO 11785 |
| Operating Mode | HDX (Half-Duplex) |
| Memory | 1360 bits |
| User Memory | 17 pages * 80 bits |
| Write/Erase Cycles | 100,000 cycles |
Superisys provides RFID solutions designed to meet the specific needs of the semiconductor industry, including high-reliability RFID+SECS/GEM integration solutions. With the rise of Industry 4.0 and the digitalization of semiconductor manufacturing, RFID technology is becoming the core infrastructure for wafer fabs' smart manufacturing and data-driven decision-making.